Samsung And TSMC Hope AMSL's New Machines Will Help Address The Chip Shortage

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Larger photomasks could increase production capacity for high-end chips and RAM.

ASML

Samsung and TSMC will join Intel in adopting ASML's latest High NA extreme ultraviolet (EUV) lithography chip fab machines, ASML announced. The three companies also unveiled a new initiative to adopt larger 12-inch photomasks that will hopefully boost manufacturing yields and lower chipmaking costs. Samsung and TSMC will deploy ASML's NA EUV tech by 2028 and 2030 respectively, while 12-inch photomasks are expected to arrive in advanced node production by 2033.

Currently, ASML's High NA EUV technology has only been deployed by Intel on its 18A process for select Core Ultra Series 3 (Panther Lake) processors. The company is also working on an advanced version called 18A-P, under consideration by Apple for its next-gen A-series iPhone processors. Today, ASML boasted that Intel has built more than a million wafers using the new process.

Now, both...

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