ASML and TSMC want bigger masks for smaller chips

Industry push aims to eliminate stitching constraints and ready high-NA EUV systems for production by 2033

ASML and chipmaking giant TSMC have launched an industry-wide push toward 12-inch photomasks, saying the larger format could lower costs and overcome some limitations of high-NA EUV lithography.

Dutch firm ASML, the only commercial supplier of EUV lithography systems, says it and TSMC have established a collaboration intended to lead the transition to larger-format photomasks for extreme ultraviolet (EUV) lithography.

Intel Foundry and Samsung Electronics have also voiced their support.

The initiative aims to establish a 12-inch mask pilot line by 2031 and have the supporting lithography systems ready for advanced node production by 2033.

According to ASML, high-NA EUV will initially enter production using current 6-inch masks, but moving to 12-inch masks could increase fab productivity, lower costs, and remove stitching constraints.

The push for larger masks stems from the anamorphic optical...

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