CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging

Project in Georgia, California, and Arizona aim to strengthen America's leadership in cutting-edge substrate technology for critical industries like AI

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry. The expected recipients are Absolics Inc. in Georgia, Applied Materials Inc. in California, and Arizona State University in Arizona.

These competitively awarded research investments, each expected to total as much as $100 million, represent novel efforts in advanced substrates. Advanced substrates are physical platforms that allow multiple semiconductor chips to be assembled seamlessly together, enable high-bandwidth communication between those chips, efficiently deliver power, and dissipate unwanted heat. The advanced packaging enabled by advanced ...