TSMC reportedly has $1 billion of Apple chips awaiting delivery of DRAM — will this be what powers the iPhone 18…
- TSMC reportedly holding roughly $1 billion of finished A20 Pro wafers that cannot be packaged because the DRAM they must be integrated with has not yet arrived
- The bottleneck exists because Apple moved the A20 Pro to TSMC's WMCM packaging, which bonds processor and memory at the wafer level, removing the option of stockpiling finished dies and adding memory later
- The launch is not expected to slip but could mean that post-launch inventory could be dicey, with thin stock and extended delivery estimates the likely outcome for Apple's upcoming devices
Around a billion dollars of finished Apple silicon is reportedly sitting at TSMC with nowhere to go, reports have claimed.
The wafers are processed, the yields are fine, and the chips cannot move to the next stage of production because the memory they need to be packaged with has not arrived.
The reason they cant be stockpiled for later use...
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