Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security

Proposed CHIPS Funding Would Support Construction of Fab and Advanced Test and Packaging Facility and Create up to 1,700 Jobs in Pennsylvania and California

Media Contact: Maddy Broas, madeline.broas [at] chips.gov (madeline[dot]broas[at]chips[dot]gov)

Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act. Through this bipartisan legislation, President Biden and Vice President Harris are revitalizing America’s semiconductor manufacturing industry while strengthening domestic supply chains, creating good-paying jobs, and helping to secure America’s technological leadership on the world stage. The proposed CHIPS funding would support the construction of a new fab in San Jose, California, and a new advanced test and packaging facility in Bethlehem, Pennsylvania. The proposed projects would be ...