TECH NEWS
PM Modi Lays Foundation Stone for ASIP Chip Packaging Plant in Visakhapatnam
Prime Minister Narendra Modi virtually laid the foundation stone for ASIP Technologies’ semiconductor assembly, packaging, and testing facility in Visakhapatnam on August 1, marking Andhra Pradesh’s entry into semiconductor manufacturing under the India Semiconductor Mission (ISM). The facility is being established on a 30-acre site at Tarluvada in partnership