SK Hynix Begins $4B US Plant To Feed Insatiable AI Chip Demand
SK hynix has officially broken ground on its first U.S. manufacturing site, kicking off construction on a $4 billion advanced packaging and R&D facility in West Lafayette, Indiana. Located within the Purdue Research Park, the 133-acre campus aims to ease a bottleneck in the AI hardware supply chain by bringing domestic high-bandwidth memory (HBM) packaging closer to major U.S. customers like NVIDIA.
In a press release, SK hynix says it will fabricate cutting-edge DRAM wafers at its facilities in South Korea before shipping them to West Lafayette. Once there, workers will stack the dies vertically using advanced interconnects to produce high-density HBM modules designed for next-generation AI accelerators.
"Furthermore, an 'Advanced Packaging R&D Testbed' will be built alongside the production lines, enabling customers, universities, and business partners to collaboratively develop next-generation packaging technologies and rapidly execute prototype fabrication and performance validation," SK hynix says.
The Indiana fab's cleanroom is...
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