Samsung signs a $200 billion chip deal with Broadcom covering memory, foundry and advanced packaging through 2030

TL;DR

Samsung signs MOU with Broadcom worth more than $200 billion for AI memory, foundry and packaging through 2030

Samsung Electronics and Broadcom have signed a memorandum of understanding worth more than $200 billion spanning memory chips, foundry manufacturing and advanced packaging for artificial intelligence semiconductors. The deal, announced on Friday at an AI summit in San Francisco, runs for five years through 2030 and covers some of the most critical layers of the AI chip supply chain. It is one of the largest semiconductor partnerships ever disclosed, though as an MOU it represents a statement of intent rather than a binding contract.

On the memory side, Samsung will supply Broadcomwith next-generation high-bandwidth memory, including HBM4 and HBM4E chips, for use in Broadcom’s AI accelerators. In foundry, Samsung will manufacture Broadcom products using two-nanometer and smaller process technologies at its campus in Pyeongtaek, South Korea. The collaboration also extends...

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