AMD commits more than $10bn to Taiwan’s AI ecosystem with ASE, SPIL and Helios as the visible deliverables
Lisa Su’s Taiwan announcement covers advanced silicon, packaging and manufacturing partnerships for the company’s rack-scale Helios platform, set for deployment in the second half of 2026.
AMD announced on Wednesday more than $10bn of investments across Taiwan’s semiconductor ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure.
The commitment covers a multi-year deployment of silicon, packaging and supply-chain capacity built around the company’s rack-scale Helios platform, scheduled for second-half 2026 customer deployment.
On named partners, the announcement covers work with ASE and SPIL on next-generation wafer-based 2.5D bridge interconnect technology, alongside other Taiwan-based suppliers AMD has not separately listed in the public release.
The technology track filed in the company’s 8-K materials is calibrated to support the Helios platform’s full-rack scale architecture, where AMD has been positioning against Nvidia’s GB200 and GB300 NVL72 systems through the past three quarters.
Chair and chief executive Lisa Su...
Copyright of this story solely belongs to thenextweb.com. To see the full text click HERE
