Xiaomi Taps TSMC For 3nm Xring O3 Chip With LPDDR6 To Battle Qualcomm
Xiaomi has expanded its silicon independence by unveiling the XRing O3, a custom flagship mobile processor built on TSMC’s 3-nanometer process node with support for LPDDR6 memory. Early performance signs via AnTuTu are proving to be very promising as well.
Xiaomi’s Xring O3 has achieved an AnTuTu score of 5.22 million, far surpassing every smartphone processor currently available. Its GPU performance has improved by a massive 85%. The chip features six ultra-large CPU cores plus four additional cores, and is also the first to… pic.twitter.com/ox8mOFpZLX— Ice Universe (@UniverseIce) August 24, 2026
Manufactured on TSMC's N3P node with 24 billion transistors spread over a 133mm² die, the XRing O3 represents Xiaomi's most aggressive push away from standard third-party mobile silicon. Ditching efficiency cores entirely, the chipset adopts a 10-core all-big CPU cluster. This setup features two C1-Ultra cores running up to 4.35GHz, four C1-Premium cores clocked at 3.68GHz, and four...
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