Will Samsung and Qualcomm’s organic bridge technology make AI processors more powerful and cheaper to produce?

• A collaboration between Samsung and Qualcomm aims to harness 'organic bridge' technology to reduce costs for AI CPUs
• The process is being developed for 2.1D packaging, a lower-cost integration than 2.5D , where silicon, glass, or ceramic materials are used
• Resins and composites are among the organic materials typically used in semiconductor integration

Samsung and Qualcomm have collaborated on a new type of CPU that takes advantage of organic materials for integration between layers, rather than silicon or its alternatives.

Described as an “organic bridge,” the technology is intended for AI semiconductors.

The development of what has been named 2.1D packaging is aimed at reducing costs in AI chip fabrication, where 2.5D packaging is typically used. 2.5D chips rely on silicon, glass, or ceramic for connectivity between layers of microcircuits. With 2.1D, however, the use of organic material improves bandwidth.

The organic bridge

The key element of the 2.1D packaging...

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