Vertiv delivers India’s first high-density liquid cooling deployment for 30 MW of AI-ready capacity
Vertiv has completed what it describes as India’s first direct-to-chip high-density liquid cooling (HDLC) deployment at CapitaLand India Trust’s CLDC Mumbai 01 data centre in Airoli, Navi Mumbai. The project uses Vertiv’s secondary fluid network (SFN) system to support 30 MW of AI workloads for a hyperscale end customer.
The deployment marks a step in the adoption of liquid cooling in India as data centre operators prepare for the higher thermal demands of AI workloads. Traditional air-cooling systems face increasing challenges as computing density rises, prompting operators to consider liquid-based approaches for high-density infrastructure.
Vertiv’s closed-loop SFN system transports coolant from a facility’s cooling infrastructure to the chip level. The system is manufactured, tested and commissioned to meet operational requirements before supporting live IT loads.
“The CapitaLand Investment project, particularly the collaboration, helped us accelerate the development of our manufacturing and engineering capabilities, enabling us to support the growing demands...
Copyright of this story solely belongs to www.expresscomputer.in. To see the full text click HERE
