TSMC breaks ground on more advanced packaging fabs in Chiayi
TSMC will build additional advanced packaging fabs in the second phase of the Chiayi Science Park in southern Taiwan, National Science and Technology Council minister Wu Cheng-wen said at a groundbreaking ceremony on Sunday.
Packaging is where the AI supply chain currently pinches, and it is the same constraint that Nvidia’s multi-year HBM4 deal with SK Hynix was written to relieve.
Wu said TSMC would add three advanced packaging facilities in Phase II on a site of roughly 90 hectares that will be developed into a packaging cluster led by the company.
Two facilities in Phase I of the park began mass production in June. Once both phases are running, companies at the Chiayi Science Park are expected to generate more than NT$300bn ($9.35bn) in annual output and support around 9,000 jobs, Wu said.
The expansion is aimed squarely at demand for high-performance computing chips, where TSMC’s CoWoS process, which...
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