TECH NEWS

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TECH NEWS

Tessolve and Intel Foundry Collaborate on Enablement for EMIB Advanced Packaging Technology

Tessolve, a leading global provider of semiconductor system and silicon solutions for next-generation products, today announced that they have collaborated with Intel Foundry to support package designs with Embedded Multi-die Interconnect Bridge (EMIB), an advanced packaging technology essential for heterogeneous integrated multi-chip(let) architectures. This collaboration enables Tessolve to support