TECH NEWS
Tessolve and Intel Foundry Collaborate on Enablement for EMIB Advanced Packaging Technology
Tessolve, a leading global provider of semiconductor system and silicon solutions for next-generation products, today announced that they have collaborated with Intel Foundry to support package designs with Embedded Multi-die Interconnect Bridge (EMIB), an advanced packaging technology essential for heterogeneous integrated multi-chip(let) architectures. This collaboration enables Tessolve to support