SEMICON India 2026: 25 Semiconductor Pacts Signed on Day 2
The second day of SEMICON India 2026 at Yashobhoomi produced 25 memoranda of understanding and announcements spanning the breadth of the semiconductor value chain, from raw materials and fabrication to power electronics, advanced packaging, logistics, design and skills training.
According to a statement from the Ministry of Electronics and Information Technology, the agreements brought together Indian and international partners around a common set of priorities: manufacturing critical materials at home, developing indigenous silicon carbide power technology, expanding access to design tools, attracting deep-tech capital, building specialised logistics capacity and widening the talent pool.
The sessions drew policymakers, executives from global chip firms, Indian manufacturers, researchers, startups, academics and students. Discussions ranged across supply chain resilience, R&D, cross-border partnerships, chip design, packaging and workforce readiness — all framed around the government’s ambition of an end-to-end “Silicon to Systems” ecosystem.
From intent to execution
Speaking in a fireside session, Union Minister for...
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