Samsung Wins $200 Billion Broadcom Contract For 2nm AI Chips
Samsung Electronics and U.S. chip designer Broadcom have entered into a landmark $200 billion agreement running through 2030, spanning memory supply, cutting-edge foundry manufacturing, and advanced packaging to power global artificial intelligence infrastructure. Signed during the AI summit in San Francisco, the five-year memorandum of understanding is now one of the largest semiconductor collaborations ever announced, giving Samsung a major commercial win as demand for custom AI hardware continues to expand.
Central to the deal is Broadcom’s plan to utilize Samsung’s sub-two-nanometer foundry process to manufacture its next-generation application-specific integrated circuits (ASICs) and high-speed networking silicon. As other giants like Meta and Google increasingly move awayfrom relying exclusively on general-purpose graphics processors, custom ASICs designed specifically for hyper-scale data centers have become the go-to architecture for running massive AI workloads efficiently. Samsung will complement this logic manufacturing by supplying Broadcom with its most advanced high-bandwidth memory, including next-gen HBM4...
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