Russian startup claims it could produce silicon wafers in five minutes instead of two weeks, but trillion-dollar IMEC…
- Russian multicathode built and tested, but full lithography machine still years away from existing
- Wafer exposure could drop from two weeks to five minutes flat
- Electron beam tips measure just 1.5 to 2 nanometers wide
A Russian startup has unveiled a multipath electronic lithograph project intended to manufacture modern microchips at significantly greater speed than before.
The core technology is a multicathode capable of generating multiple electron beams simultaneously, which has reportedly been built and tested by engineers.
Developers say the device could expose a silicon wafer in roughly five to seven minutes, compared with one to two weeks for older single-beam machines.
Multicathode breakthrough
"We have developed an end-to-end technology for creating a multicathode and confirmed its operability in practice," said Evgeny Givargizov, the project's main developer.
He added that arrays of these electron sources rank among the sharpest ever produced, with tip radii of only 1.5 to 2...
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