Qualcomm's proposed solution to catch up in AI infra: Bury the compute under the DRAM
Qualcomm is finally getting serious about AI infrastructure, but its push into the datacenter hinges on the success of an ambitious near-memory compute architecture designed to deliver better inference economics than today's GPUs.
Announced during its 2026 investor day last week, the tech will see Qualcomm stack layer upon layer of DRAM on top of its XPUs to form a single unified compute and memory module it's calling high-bandwidth compute (HBC).
“We offer all of the performance advantages of SRAM, but with the density and the memory capacity that HBM (high-bandwidth memory) stacks offer,” Tony Pialis, Qualcomm’s EVP of datacenter, claimed during last week's investor presentation.
This technology is set to launch next year as part of Qualcomm’s AI250-series of Dragonfly rack systems, and marks a distinct shift in Qualcomm’s AI infrastructure strategy. The handset giant is no stranger to AI accelerators. Essentially every Snapdragon processor sold today ships...
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