Paras Semiconductors partners with US firm BroadPak to develop advanced packaging capabilities in India
Paras Semiconductors, a subsidiary of Paras Defence & Space Technologies, has partnered with US-based BroadPak Corporation to develop advanced semiconductor packaging capabilities in India. The collaboration aims to establish an outsourced semiconductor assembly and test (OSAT) facility focused on 2.5D/3D packaging, chiplet integration and other advanced packaging technologies.
The proposed facility will bring together Paras Semiconductors’ manufacturing plans in optoelectronics and photonics with BroadPak’s expertise in semiconductor packaging, heterogeneous integration and multi-die architectures.
The companies plan to develop capabilities across hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and semiconductor testing and qualification. The facility is also expected to cater to applications in high-performance computing (HPC), networking and data centres.
Focus on 2.5D/3D packaging and chiplet integration
Under the partnership, Paras Semiconductors will gain access to BroadPak’s technology intellectual property, design and manufacturing expertise, along with process know-how and technology transfer in 2.5D/3D packaging and chiplet integration.
The companies...
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