Madhya Pradesh Signs MoU With Paras Semiconductors For Proposed ₹6,200 Crore OSAT Facility
Paras Semiconductors has signed an MoU with the Madhya Pradesh government to establish a proposed ₹6,200 crore semiconductor packaging and testing facility on the Ujjain-Indore Corridor.
The Government of Madhya Pradesh signs a MoU with Paras Semiconductors Pvt. Ltd., the semiconductor business of Paras Defence & Space Technologies Ltd., to establish a proposed ₹6,200 crore semiconductor packaging facility in the state.
As part of the agreement, the state government has allotted 50 acres of land on the Ujjain-Indore Corridor for the proposed Outsourced Semiconductor Assembly and Test (OSAT) facility. The announcement was made on July 22.
According to the company, the project is expected to support India's semiconductor manufacturing ecosystem and generate employment in the state. The investment proposal is subject to project execution and regulatory approvals.
Facility to Focus on Advanced Packaging Technologies
Paras Semiconductors said the proposed facility will manufacture and package semiconductor devices for strategic and high-performance...
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