Intel and 3DGS back a $3.3bn glass-substrate plant in India’s Odisha
The fight over who makes the world’s chips is increasingly a fight over the parts of a chip nobody photographs. India has just landed one of them.
Intel and 3D Glass Solutions have signed an agreement to build a roughly $3.3 billion substrate-manufacturing plant in the eastern state of Odisha, the government announced on Friday.
The memorandum of understanding, signed between the Odisha government, Intel Corporation and 3DGS Inc., covers an advanced-packaging glass-core substrate facility in the Bhubaneswar-Khurda region, to be built over five to six years.
India’s electronics and IT minister, Ashwini Vaishnaw, framed it as one of the largest high-technology manufacturing commitments the country has secured.
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Substrates are the unglamorous layer that...
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