Cadence's AuraStack agent melds AI with HPC to speed PCB, advanced packaging design
ai and ml
One-two punch offers a glimpse of how low-precision AI can complement high-precision simulations
How AI will change the way scientific computing is done remains an open question. One relies on ultra-precise double-precision mathematics, while the other is perfectly happy working with 4 bits.
On the surface, the two are diametrically opposed, two extremes of a spectrum we call high-performance computing (HPC) — and yes, whether you like it or not, AI is HPC.
However, the latest AI offering from Cadence Design Systems, one of the biggest names in industrial HPC, offers a glimpse of how high- and low-precision compute could not just coexist, but work together to solve bigger and more complex problems faster and with fewer resources.
Announced on Wednesday, Cadence’s AuraStack is an agentic AI system built to assist electrical engineers to design and test printed circuit boards (PCBs), or conduct advanced packaging design and...
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