Applied Materials partners with SCREEN to bring advanced wafer cleaning technologies to EPIC Center
Applied Materials announced that SCREEN Semiconductor Solutions has joined the EPIC Center as its newest innovation partner. The collaboration will bring together SCREEN SPE’s expertise in wafer cleaning technology with Applied’s leadership in materials engineering to develop co-optimised process solutions for the world’s most advanced chips.
As semiconductor devices have become increasingly complex, precise wafer surface cleanliness has become a critical enabler of yield, device performance, and reliability at the most advanced process nodes. Any defects introduced during deposition, etch, and materials modification steps must be addressed with ever-greater precision, making co-optimised cleaning solutions an essential component of developing next-generation materials engineering technologies.
By combining Applied’s deep process expertise across deposition, dry etch and materials modification with SCREEN SPE’s industry-leading cleaning, wet etch and surface preparation capabilities, the two companies can develop co-optimised, end-to-end process solutions that help chipmakers achieve higher yields and faster time-to-production on next-generation devices.
“The EPIC...
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