AMD’s Helios puts 72 GPUs and 31 terabytes of HBM4 in one rack. It is AMD’s answer to Nvidia’s NVL72.
TL;DR
AMD Helios packs 72 MI455X GPUs, 31TB HBM4, and 2.9 exaflops of inference into one rack. Built on open standards. Engineering samples H2 2026, mass production Q2 2027.
AMD’s Helios is a single rack containing 72 Instinct MI455X GPUs, 31 terabytes of HBM4 memory, and 2.9 exaflops of FP4 inference compute. It is AMD’s first rack-scale AI system and its direct answer to Nvidia’s Vera Rubin NVL72. The system uses 18 compute trays, each holding four MI455X accelerators on the new CDNA 5 architecture and one sixth-generation EPYC “Venice” CPU. Engineering samples ship in the second half of 2026. Mass production begins Q2 2027.
The architecture bet is open standards. Helios uses UALink for scale-up interconnect between GPUs within the rack, Ultra Ethernet Consortium specifications for scale-out networking between racks, and the OCP Open Rack Wide form factor. Nvidia’s competing NVL72 uses proprietary NVLink. AMD is betting...
Copyright of this story solely belongs to thenextweb.com. To see the full text click HERE
