AMD Zen 7 Grimlock Reportedly Targets TSMC's Cutting-Edge 1.4nm A14 Process
Don't worry, you haven't missed a big release. AMD's next-generation Zen 6 chips are launching later this year, although they're only coming to servers, most likely; gamers and other consumers will probably have to wait until next year. The company obviously isn't standing still, though, and so it is reportedly laying the groundwork for its next-next-generation architecture, Zen 7. According to Commercial Times Taiwan (CTEE), Zen 7 will be fabricated on TSMC's A14 process, and at least some of the chips will reportedly use external packaging, too.
Let's start with the big news: CTEE says that AMD's Zen 7 is slated for fabrication on TSMC's A14 process. As you could probably guess from the name, this is a 1.4nm-class or 14-angstrom-class lithography process. What's interesting is that, unlike Intel, who went all in on bleeding-edge manufacturing tech with its 18A process, TSMC's A14 process is not expected to have Super...
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