AMD FPGA and Micron memory found in Russia's Iskander-1000 ballistic missile, Ukraine Intelligence claims —…

• HUR identified 140 components linked to the upgraded Iskander missile system
• American manufacturers supplied 63 of the missile's identified electronic components
• Only one-quarter of all components came from Russian domestic manufacturers

Ukraine’s Defense Intelligence (HUR) has released details about foreign-made parts it says were found inside Russia’s upgraded Iskander-1000 ballistic missile.

The disclosure said American companies, including Xilinx, part of AMD, Atmel, part of Micron Technology, DM&P Electronics, Winbond Electronics, and Analog Devices, supplied critical parts for the missile's guidance and processing systems.

The agency also identified 140 components linked to the missile and said only a limited share came from Russian manufacturers.

Foreign chips remain inside Russia’s upgraded missile system

The disclosure points to continued foreign technology use in a weapon system developed by Moscow despite efforts to reduce outside dependence.

According to Ukrainian intelligence, 35 companies are connected to the production network supporting Russia’s Iskander-M missile family.

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